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1/16 XCL211/xcl212 series 2.0a inductor built-in step-down ?micro dc/dc? converters greenoperation compatible etr28006-001 XCL211b082dr /xcl212b082dr typical performance characteristics typical application circuit general description the XCL211/xcl212series is a synchronous step-down micro dc/dc converter which integrates an inductor and a control ic in one tiny package (3.1mm 4.7mm, h=1.3mm). an internal coil simplifies the circuit an d enables minimization of noise and other operational trouble due to the circuit wiri ng. a wide operating voltage range of 2.7v to 6.0v enables support fo r applications that require an externally set output voltage c an be selected. the XCL211/xcl212 series uses synchronous rectif ication at an operating freque ncy of 2.4mhz. pwm control (XCL211) or automatic pwm/pfm switch ing control (xcl212) can be selected. the XCL211 series has a fixed frequency, enabling the suppression of output ripple. the xcl212 series achi eves high efficiency while holding down output ripple across t he full range of loads, from light to heavy, enabl ing the extension of battery operation time. the series have a high speed soft-start as fast as 1ms in ty pical for quick turn-on. with the built-in uvlo (under voltage lock out) function, the internal p-channel driver transistor is forc ed off when input voltage becomes 2.4v or lower. it?s suitable f or large-current application due to limit current is configured 4.0a in typical. the integrated c l discharge function which enables the electric charge at the output capacitor c l to be discharged via the internal discharge switch located between the lx and gnd pins. due to c l discharge function, malfunction on lx is prevented when stand-by mode. features package size : 3.1mm 4.7mm, h=1.3mm input voltage : 2.7v 6.0v output voltage : 0.9v v in (fb voltage=0.8v 2%) high efficiency : 94% (v in =5.0v, v out =3.3v) output current : 2.0a oscillation frequency : 2.4mhz ( 15%) maximum duty cycle : 100% control methods : pwm (XCL211) pwm/pfm (xcl212) functions : current limit circuit (automatic return) soft-start circuit built-in c l discharge, uvlo output capacitor : low esr ceramic capacitor operating ambient temperature : -40 +85 package : usp-11b01 environmental friendly : eu rohs compliant, pb free applications note pcs printers tablet pcs pnd(portable navigation device) ? 0 20 40 60 80 100 0.1 1 10 100 1000 10000 efficiency : effi (%) output current : i out (ma) XCL211 xcl212 v in =5.0v v out =3.3v
2/16 XCL211/xcl212 series ce/b error amp. vref with soft start, ce current feedback current limit pwm comparator uvlo uvlo cmp ramp wave generator osc lx fb ce control logic inductor gnd l2 l1 pwm/pfm selector pv in av in phase compensation r2 r1 thermal shutdoun synch buffer drive logic ce block diagram XCL211/xcl212 series (usp-11b01) * the XCL211 offers a fixed pwm control, a control logic of pwm/pfm selector is fixed at ?pwm? internally. the xcl212 control scheme is a fixed pwm/pfm automatic switching, a control logic of pwm/pfm selector is fixed at ?pwm/pfm auto matic switching? internally. diodes inside the circuit are an esd pr otection diode and a parasitic diode. product classification ordering information XCL211 ????? fixed pwm xcl212 ????? pwm/pfm auto switching designator item symbol description type b refer to selection guide ? reference voltage 08 reference voltage is fixed at 0.8v oscillation frequency 2 2.4mhz ? (*1) package (order unit) dr usp-11b01 (*2) (1,000pcs/reel) (*1) halogen free and eu rohs compliant. (*2) the usp-11b01 reels are shipped in a moisture-proof packing. selection guide type soft-start time chip enable current limiter thermal shutdown uvlo c l auto- discharge b fixed yes yes yes yes yes
3/16 XCL211/xcl212 series pin configuration pin assignment pin number pin name functions 1 nc no connection 2 lx switching output 3 lx switching output 4 nc no connection 5 fb output voltage monitor 6 ce chip enable 7 av in analog input 8 gnd ground 9 pv in power input 10 l1 inductor electrodes 11 l2 inductor electrodes ce pin function pin name signal status ce low stand-by high active * please do not leave the ce pin open. absolute maximum ratings ta = 2 5 all voltages are described based on the ground voltage of gnd. (*1) please connect pv in pin (no.9) and av in pin (no.7) for use. (*2) the maximum value should be either +7.0 or v pvin +0.3 in the lowest. (*3) it is measured when the two lx pins (no.2 and 3) are tied up to each other. parameter symbol ratings unit pvin pin voltage v pvin -0.3 ~ +7.0 (*1) v avin pin voltage v avin ce pin voltage v ce -0.3 ~ +7.0 v fb pin voltage v fb -0.3 ~ +7.0 v lx pin voltage v lx -0.3 ~ +7.0 or v pvin +0.3 (*2) v lx pin current i lx 6.0 (*3) a power dissipation usp-11b01 pd 1000 mw operating ambient temper ature topr -40 ~ +85 storage temperature t stg -55 ~ +125 usp-11b01 (bottom view) * please connect the av in pin (no.7) and the pv in pin (no.9) when operating. * please connect the l x pins (no.2 and no.3). nc lx lx nc fb ce gnd av in pv in
4/16 XCL211/xcl212 series electrical characteristics XCL211b082dr/xcl212b082dr, ta=25 parameter symbol conditions min. typ. max. unit circuit fb voltage v fb v in =5.0v, v ce =5.0v voltage to start oscillation while v fb =0.72v 0.88v 0.784 0.800 0.816 v operating voltage range v in when connected to external components 2.7 - 6.0 v maximum output current i outmax v in =v ce =5.0v (*1,*2) when connected to external components 2.0 - - a uvlo voltage v uvlo v ce =5.0v, v fb =0.72v voltage which lx pin holding ?l? level (*3) 2.00 - 2.68 v quiescent current iq v in =v ce =5.0v, v fb =0.88v - 53 92 a stand-by current i stb v in =5.0v, v ce =0v, v fb =0.88v - 0.01 1.00 a oscillation frequency f osc v in =v ce =5.0v, i out =300ma when connected to external components 2040 2400 2760 khz pfm switch current (*4) i pfm v in =v ce =6.0v, i out =1ma when connected to external components - 680 - ma pfm duty limit (*4) dty limit_pfm v in =v ce =2.7v, i out =1ma when connected to external components - 180 250 % maximum duty cycle d max v in =v ce =5.0v, v fb =0.72v 100 - - % minimum duty cycle d min v in =v ce =5.0v, v fb =0.88v - - 0 % lxsw?h?on resistance r lxh v in =v ce =4.0v, v fb =0.72v (*6) - 0.11 0.21 ? lxsw?l?on resistance r lxl - 0.12 0.30 (*7) ? - lxsw?h? leakage current i leakh v in =5.0v, v ce =0v, v fb =0.88v, v lx =0v - 0.01 1.00 (*8) a current limit i lim v in =v ce =5.0v, v fb =0.72v (*9) - 4.0 - a output voltage temperature characteristics ? v out / ( ? topr ? v out ) i out =100ma -40 Q topr Q 85 when connected to external components - 100 - ppm/ ce ?h? voltage v ceh v in =5.0v, v fb =0.72v applied voltage to v ce voltage changes lx to ?h? level 1.2 - v in v ce ?l? voltage v cel v in =5.0v, v fb =0.72v applied voltage to v ce voltage changes lx to ?l? level gnd - 0.4 v ce ?h? current i ceh v in =5.0v, v ce =5.0v, v fb =0v -0.1 - 0.1 a ce ?l? current i cel v in =5.0v, v ce =0v, v fb =0v -0.1 - 0.1 a fb ?h? current i fbh v in =5.0v, v ce =0v, v fb =5.0v -0.1 - 0.1 a fb ?l? current i fbl v in =5.0v, v ce =0v, v fb =0v -0.1 - 0.1 a soft-start time t ss v in =5.0v, v ce =0v 5.0v, i out =1ma when connected to external components 0.3 1.0 2.0 ms thermal shutdown temperature t tsd - 150 - - hysteresis width t hys - 20 - - c l discharge resistance r dchg v in =5.0v, v ce =0v, v fb =0.72v, v lx =1.0v 80 130 160 ? inductance l test freq.=1.0mhz - 1.5 - h - inductor rated current i dc ? t=+40 - 2.3 - a - external components: c in1 =20 f(ceramic), c in2 =1 f(ceramic), c l =20 f(ceramic), r1=15k ? , r2=30k ? , c fb =1000pf condition: unless otherwise stated,?h?= v in ~ v in - 1.2v, ?l?= + 0.1v ~ -0.1v (*1) mount conditions affect heat dissipation. ma ximum output current is not guaranteed when t tsd starts to operate earlier. (*2) when the difference between the input and the output is small, so me cycles may be skipped completely before current maximizes. if current is further pulled from this state, output vo ltage will decrease because of p-ch driver on resistance. (*3) these values include uvlo detect voltage, uvlo re lease voltage and hysteresis operating voltage range. uvlo release voltage is defined as the v in voltage which makes lx pin ?h?. (*4) XCL211 series exclude i pfm and dty limit_pfm because those are only for th e pfm control?s functions. (*5) on resistance = (v in ? lx pin measurement voltage) / 0.1a (*6) design value (*7) when temperature is high, a current of approximately 20 a (maximum) may leak. (*8) current limit denotes the level of detection at peak of coil current.
5/16 XCL211/xcl212 series test circuits < circuit no. > < circuit no. > < circuit no. > < circuit no. > < circuit no. > < circuit no. > external components c in1 20fceramic c in2 1fceramic c l 20fceramic r1 15k r2 30k c fb 1000pfceramic l 1.5h(selected goods) v ce v in a l wave form measure point lx pvin gnd fb avin ce l1 l2 c fb v a r1 r2 c l i out c in2 c in1 v ce v in a lx pvin gnd fb avin ce l1 l2 1f v fb v ce v in lx pvin gnd fb avin ce l1 l2 1f v fb 200 wave form measure point v ce v in lx pvin gnd fb avin ce l1 l2 1f v fb il wave form measure point v ce v in lx pvin gnd fb avin ce l1 l2 1f v fb i leakh a i fb h a i fb l a i ceh i cel a v ce v in lx pvin gnd fb avin ce l1 l2 1f v fb il a v v lx
6/16 XCL211/xcl212 series typical application circuit note: the integrated inductor can be used only for this dc/dc conver ter. please do not use this inductor for other reasons. external components value product number c in1 c l 10v/10 f lmk212abj106kg (taiyoyuden) lmk212ab7106mg (taiyoyuden) c2012jb1a106k125ac (tdk) c2012x7r1a106k125ac (tdk) 10v/22 f lmk212bbj226mg (taiyoyuden) c2012jb1a226m125ab (tdk) c in2 16v/1 f emk107bj105ka (taiyoyuden) emk107b7105ka (taiyoyuden) c1005jb1c105k050bc (tdk) c1005x5r1c105k050bc (tdk) c1608x7r1c105k080ac (tdk) output voltage can be set by adding external split resistors. output voltage is determined by the following equation, based on the values of rfb1 and rfb2. the sum of rfb1 and rfb2 should normally be 100k or less. output voltage range is 0.9v~5.5v by a 0.8v (2.0%) reference voltage. when input voltage (v in ) Q setting output voltage, output voltage (v out ) can not output the power more than input voltage (v in ). v out = 0.8 x (r1 + r2) / r2 the value of c fb , speed-up capacitor for phase compensation, should be f zfb = 1 / (2 x x cfb x rfb1) which is equal to 20khz. adjustments are required from 1khz to 10khz depending on the application, value of inductance (l), and value of load capacitance (c l ). [example of calculation] when r fb1 =47k ? , r fb2 =15k ? , v out =0.8(47k ? +15k ? ) / 15k ? =3.3v when c fb =330pf, fzfb= 1/(2 330pf 47 k ? ) =10.26khz v out r fb1 r fb2 c fb v out r fb1 r fb2 c fb (v) (k ? ) (k ? ) (pf) (v) (k ? ) (k ? ) (pf) 1.0 7.5 30 2000 2.5 51 24 300 1.2 15 30 1000 3.0 33 12 470 1.5 26 30 560 3.3 47 15 330 1.8 30 24 510 5.0 43 8.2 390 v ce v in lx pvin gnd fb avin ce l1 l2 c fb r1 r2 c l c in2 c in1 v out note: the minimum value of the c in1 should be 10 f, and it is optimum to set a capaci tance value depends on the input impedance. the value of the c l should be within the range from 20 f to 47 f.
7/16 XCL211/xcl212 series operational description the XCL211/xcl212 series consists of a refe rence voltage source, ramp wave circuit, e rror amplifier, pwm comparator, phase comp ensation circuit, output voltage adjustment resistors, p-channel mos driver transistor, n-channel mos switching transistor for the synch ronous switch, current limiter circuit, uvlo circuit and ot hers. (see the block diagram below) the se ries ics compare, using the error amplif ier, the voltage of the internal voltage reference source with the feedba ck voltage from the fb pin. phase compensation is performed on the resulting error amplifier output, to input a signal to the pwm comparator to determine the turn-on time during pwm operation. the pwm co mparator compares, in terms of voltage level, the signal from the error am plifier with the ramp wave from the ramp wave circuit, and del ivers the resulting output to the buffer driver circuit to cause the lx pin to output a switching duty cycle. this process is continuously perform ed to ensure stable output voltage. the current feedback circuit monitors the p-chann el mos driver transistor curr ent for each switching operation , and modulates the error amplifier output signal to provide multiple feedba ck signals. this enables a stable feedback loop even when a low es r capacitor such as a ceramic capacitor is us ed ensuring stable output voltage. the reference voltage source provides the reference volt age to ensure stable output voltage of the dc/dc converter. the ramp wave circuit determines switching frequency. the freque ncy is fixed internally and can be selected from 1.2mhz or 2.4 mhz. clock pulses generated in this circuit are used to produce ramp waveforms needed for pwm operation, and to synchronize all the internal circuits. the error amplifier is designed to monitor output voltage. the amplifier compares the reference voltage with the feedback volt age divided by the external split resistors, r1 and r2. when a voltage lower than the reference voltage is fed back, the output voltage of th e error amplifier increases. the gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized s ignal to the mixer. the XCL211/xcl212 series includes a fold-back circuit, which aids the operation of t he current limiter and circuit protection. the XCL211/xcl212 series monitors the current flow ing through the p-channel mos driver transistor when current flowing through p-channel mos dr iver transistor reaches current limit i lim , the current limiter circuit operates to limit the inductor current i lx . if this state continues, the fold-back circuit operates and limit the output current in order to protect the ic from damage. the output voltage is automatically resumed if the load goes ligh t. when it is resumed, the soft-start function operates. v ce v in lx pvin gnd fb avin ce l1 l2 c fb r1 r2 c l c in2 c in1 v out
8/16 XCL211/xcl212 series 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 2 4 6 8 101214161820 discharge time: t(ms) output voltage: v out (v) vout = 1. 2v vout = 1. 8v vout = 3. 3v output voltage dischage characteristics rdischg = 130 ? (typ.) v out =1.2v v out =1.8v v out =3.3v c l =20 f operational description (continued) for protection against heat damage, the thermal shutdown function monitors chip temperat ure. when the chip?s temperature reach es 150 o c (typ.), the thermal shutdown circuit starts operating and the p- channel driver transistor will be turned off. at the same time , the output voltage decreases. when the temperature drops to 130 o c (typ.) after shutting off the current flow, the ic performs the soft start function to initiate output startup operation. < function of ce pin > the XCL211/212 series will enter into stand-by mode by inputting a low level signal to the ce pin. during a stand-by mode, the current consumption of the ic becomes 0 a (typ.). the ic starts its operation by inputting a high le vel signal to the ce pin. the input of the ce pin is a cmos input and the sink current is 0 a (typ.). when the vin pin voltage becomes 2.4v (typ.) or lower, the p-ch annel mos driver transistor output driver transistor is forced o ff to prevent false pulse output caused by unstable operation of the internal circuitry. when the v in pin voltage becomes 2.68v (max.) or higher, switching operation takes place. by releasing the uvlo function, the ic performs the soft start function to initiate output startup oper ation. the soft start function operates even when the vin pin voltage falls momentarily below the uvlo operating voltage. the uvlo circuit does not cause a complete shutdown of the ic, but causes pulse output to be sus pended; therefore, the internal circuitry remains in operation. the XCL211/xcl212 series provide 1.0ms (typ). soft start time is defined as the time interval to reach 90% of the output voltag e from the time when the v ce is turned on. the XCL211/xcl212 series can quickly discharge t he electric charge at the output capacitor (c l ) when a low signal to the ce pin which enables a whole ic circuit put into off state, is inputted via the n-channel mos switch transistor located between the l x pin and the v gnd pin. when the ic is disabled, electric charge at the output capacitor (c l ) is quickly discharged so that it may av oid application malfunction. discharge time of the output capacitor (c l ) is set by the c l auto-discharge resistance (r) and the output capacitor (c l ). by setting time constant of a c l auto-discharge resistance value [r ] and an output capacitor value (c l ) as ( =c x r), discharge time of the output voltage after discharge via the n-channel transistor is calc ulated by the following formulas. v = v out(e) e -t / or t = ln (v out(e) /v) v : output voltage after discharge v out(e) : output voltage t: discharge time : c l r dchg c l : capacitance of output capacitor r dchg : c l auto-discharge resistance r dchg
9/16 XCL211/xcl212 series operational description (continued) (*1) in pfm control operation, until coil current reaches to a specif ied level (ipfm), the ic keeps the p-channel mos driver transis tor on. in this case, time that the p-channel mos driver transistor is kept on (t on ) can be given by the following formula. please refer to i pfm t on = l i pfm / (v in - v out ) (*1) in pfm control operation, the pfm duty limit (dty limit_pfm ) is set to 200% (typ.). therefore, under the condition that the duty increases (e.g. the condition that the step-down ratio is small), it?s possible for p-channel mos driver transisto r to be turned off even when coil current doesn?t reach to ipfm. please refer to i pfm (*1) XCL211 series is excluded. fig. fig.
10/16 XCL211/xcl212 series note on use 1. please use this ic within the stated maximum ratings. for temporary, transitional voltage drop or voltage rising phenomenon , the ic is liable to malfuncti on should the ratings be exceeded. 2. where wiring impedance is high, operations may become un stable due to noise and/or phase lag depending on output current. please wire the input capacitor (c in ) and the output capacitor (c l ) as close to the ic as possible. 3. when the difference between v in and v out is large in pwm control, very narrow pulses w ill be outputted, and there is the possibility that some cycles may be skipped completely. 4. when the difference between v in and v out is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that some cycles may be skipped completely. 5. with the ic, the peak current of the coil is controlled by the current limit circuit. since the peak current increases whe n dropout voltage or load current is high, current limit starts operation, and this can lead to instability. when peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. in addition, please calculate the peak current according to the follow ing formula: ipk = (v in -v out )onduty / (2lf osc ) + i out l : coil inductance value f osc : oscillation frequency 6. use of the ic at voltages below the recommended voltage range may lead to instability. 7. this ic should be used within the stated absolute ma ximum ratings in order to prevent damage to the device. 8. when the ic is used in high temperature, output voltage may increase up to input voltage level at no load because of the le ak current of the p-channel driver transistor. 9. the XCL211/xcl212 uses fold-back circuit limiter. however, fold-back may become ?droop? affected by the wiring conditions. care must be taken especially for c in distance and position. 10. if c l capacitance reduction happens such as in the case of low temper ature, the ic may enter unstable operation. care must be taken for c l capacitor selection and its capacitance value. 1ch v lx 2.0v/di 2ch v out 50mv/di ta = - 50 v in = 3.6v, v out = 0.9v, f osc = 2.4mhz c in = 20 f(ceramic) c l = 14.7 f(ceramic) i out = 300ma 11. torex places an importance on impr oving our products and its reliability. however, by any possibility, we would request user fail- safe design and post-aging treatment on system or equipment. x-axis : 2.0 s / div
11/16 XCL211/xcl212 series note on use (continued) 12) instructions of pattern layouts (1) in order to stabilize v in voltage level, we recommend that that a by-pass capacitor (c in ) be connected as close as possible to pv in pin, av in pin and gnd pins. (2) make sure to avoid noise from the pv in pin to the av in pin. (3) please mount each external component as close to the ic as possible. (4) wire external components as close to the ic as possible and use thick, short connecting traces to r educe the circuit imped ance. (5) make sure that the pcb gnd traces are as thick as po ssible, as variations in ground potential caused by high ground curren ts at the time of switching may result in instability of the ic. (6) this series? internal driver tran sistors bring on heat because of the output current and on resistance of p-channel and n- channel mos driver transistors. <1st> <2nd> <4th> <3rd>
12/16 XCL211/xcl212 series typical performance characteristics (1) output voltage vs. output current (2) efficiency vs. output current (3) ripple voltage vs. output current vout=1.8 vout=3.3 vout=1.8v/ ?R vout=1.8 vout=3.3 vout=3.3 vout=1.8v/ ?? vout=1.8 0 20 40 60 80 100 0.1 1 10 100 1000 10000 efficiency : effi (%) output current : i out (ma) 5.0v XCL211 xcl212 v in =3.7v 0 20 40 60 80 100 0.1 1 10 100 1000 10000 ripple voltage : vr(mv) output current : i out (ma) xcl212 v in =3.7v,5.0v XCL211 v in =3.7v,5.0v 0 20 40 60 80 100 0.1 1 10 100 1000 10000 ripple voltage :vr (mv) output current : i out (ma) xcl212 XCL211 v in =5.0v 3.1 3.2 3.3 3.4 3.5 0.1 1 10 100 1000 10000 output voltage : v out (v) output current : i out (ma) XCL211 v in =5.0v xcl212 0 20 40 60 80 100 0.1 1 10 100 1000 10000 efficiency : effi (%) output current : i out (ma) XCL211 xcl212 v in =5.0v 1.6 1.7 1.8 1.9 2.0 0.1 1 10 100 1000 10000 output voltage : v out (v) output current : i out (ma) xcl212 v in =3.7v,5.0v XCL211 v in =3.7v,5.0v
13/16 XCL211/xcl212 series typical performance characteristics (continued) (4) output voltage vs. ambient temperature vout=1.8v vout=3.3v (5) oscillation frequency vs. ambient temperature XCL211b082dr vout=1.8v XCL211b082dr vout=3.3v 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 -50 -25 0 25 50 75 100 125 oscillation fr equency : fosc (mhz) ambient temperature : ta ( ) v out =3.3v i out =1ma v in =4.0v v in =5.0v 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 -50 -25 0 25 50 75 100 125 oscillation fr equency : fosc (mhz) ambient temperature : ta ( ) v in =3.0v v out =1.8v i out =1ma v in =4.0v v in =5.0v 3.0 3.1 3.2 3.3 3.4 3.5 3.6 -50 -25 0 25 50 75 100 125 output voltage : v out (v) ambient temperature : ta ( ) xcl212 v in =5.0v XCL211 v in =5.0v v out =3.3v i out =1000ma 1.5 1.6 1.7 1.8 1.9 2.0 2.1 -50 -25 0 25 50 75 100 125 output voltage : v out (v) ambient temperature : ta ( ) XCL211 v in =3.0v,5.0v xcl212 v in =3.3v,5.0v v out =1.8v i out =1000ma (6) load transient response XCL211b082dr vout=1.8v v out =1.8v i out =1ma ? 2000ma 1 2 1ch:100mv/div, 2ch:i out sw 2.0v/div, h:100us/div xcl212b082dr vout=1.8v v out =1.8v i out =1ma ? 2000ma 1 2 1ch:100mv/div, 2ch:i out sw 2.0v/div, h:100us/div
14/16 XCL211/xcl212 series packaging information usp-11b01 (unit:mm) usp-11b01 reference pattern layout (unit: mm) usp-11b01 reference metal mask design (unit: mm) 4 5 6 (0.9) (1.9) (0.2) 1.00.05 2.10.05 (1.2) (1.325) 0.250.05 (0.05) (0.4) (0.3) 0.50.05 (1.1) 1.60.05 0.250.05 (0.3) 3 1 2 97 8 10 11 (0.675) (0.675) 3.10.1 4.70.1 1pin indent 1.35 max 1.35 max (0.5) (0.2) 2.20.1 (0.8)
15/16 XCL211/xcl212 series marking rule represents product series represents integer of the reference voltage represents oscillation frequency ? represents production lot number 01 to 09, 0a to 0z, 11 to 9z, a1 to a9, aa to az, b1 to zz repeated (g, i, j, o, q, w excluded) *no character inversion used. mark product series c XCL211****** d xcl212****** mark output voltage (v) product series a 0.8 (fix) xcl21**08*** mark oscillation frequency (mhz) product series 2 2.4 xcl21****2** usp-11b01 ?? ?
16/16 XCL211/xcl212 series 1. the products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. consult us, or our representatives before use, to confirm that the informat ion in this datasheet is up to date. 2. we assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any info rmation and circuitry in this datasheet. 3. please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. the products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. please use the products listed in this datasheet within the specified ranges. should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. we assume no responsibility for damage or loss due to abnormal use. 7. all rights reserved. no part of this dat asheet may be copied or reproduced without the prior permission of torex semiconductor ltd.

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